100W Module Technical Datasheet RF DATA Item Spec. Remarks Frequency Range 300-400MHz Bandwidth Range±10MHz
Description The module is designed for commercial applications. The latest device technologies and design methods are employed to offer high power density, efficiency, and linearity in a small, lightweight package. Specification
Main Technical Specifications Parameter Code Min TYP Max Unit Operating Frequency BW 2.45 GHz Saturated
Description The module is designed for both military and commercial applications. The latest device technologies and design methods are employed to offer high power density, efficiency, and linearity in a small, lightweight package. Specification Typical performance at +28 VDC +25oC, and in a 50Ω system. RF
Description The module is designed for both military and commercial applications. The latest device technologies and design methods are
Description The chassis is designed for both military and commercial applications. The latest device technologies and design methods are employed to offer high power density,
Description The module is designed for both military and commercial applications. The latest device technologies and design methods are
Description The module is designed for commercial applications. The latest device technologies and design methods are employed to offer high power density, efficiency, and linearity in a small, lightweight package. Specification Typical performance at +48V DC +25oC, and in a 50Ω system. RF / ELECTRICAL
Description The module is designed for both military and commercial applications. The latest device technologies and design methods are employed to offer high power density, efficiency, and linearity in a small, lightweight package. Specification Typical performance at +28VDC +25oC, and in a 50Ω system. RF / ELECTRICAL
Description The module is designed for both Industrial and commercial applications. The latest device technologies and design methods are
Description The module is designed for both Industrial and commercial applications. The latest device technologies and design methods are employed to offer high power density,
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